Title:
ELECTRONIC MODULE, DEVICE, AND MANUFACTURING METHOD FOR ELECTRONIC MODULE
Document Type and Number:
Japanese Patent JP2023101235
Kind Code:
A
Abstract:
To provide an electronic module with excellent shock resistance.SOLUTION: An electronic module includes: an electronic component having a first electrode and a second electrode which are arranged on a main surface; a wiring board having a third electrode and a fourth electrode which are arranged on the main surface; and a conductive resin part. The conductive resin part includes: a first conductive resin part jointing the first electrode and the third electrode, and a second conductive resin part jointing the second electrode and the fourth electrode; and a reinforcing resin part arranged between the first conductive resin part and the second conductive resin part and jointing the main surface of the electronic component and the main surface of the wiring board.SELECTED DRAWING: Figure 2
Inventors:
HASEGAWA MITSUTOSHI
Application Number:
JP2022001734A
Publication Date:
July 20, 2023
Filing Date:
January 07, 2022
Export Citation:
Assignee:
CANON KK
International Classes:
H05K3/32; H04N23/54; H05K1/18
Attorney, Agent or Firm:
Takuma Abe
Sougo Kuroiwa
Sougo Kuroiwa