Title:
RESIN COMPOSITION FOR FORMING TEMPORARY FIXATIVE, TEMPORARY FIXATIVE, SUPPORT TAPE FOR SUBSTRATE CONVEYANCE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2023101236
Kind Code:
A
Abstract:
To provide a temporary fixative that suppresses the peeling between a support and a substrate during processing including heating and also allows easy peeling from the substrate after the processing, and a resin composition for forming the temporary fixative.SOLUTION: This resin composition for forming a temporary fixative contains an acrylic rubber having an epoxy group and a silicone compound having an amine group. When a film is formed by heating this composition for 5 minutes at 90°C and for 5 minutes at 140°C, the modulus of elasticity of the film is 2 MPa or greater at 100°C and the modulus of elasticity of the film after heating for 2 hours at 170°C is 500 MPa or greater at 25°C.SELECTED DRAWING: None
Inventors:
OGAWA SAEKO
SOBUE SHOGO
SOBUE SHOGO
Application Number:
JP2022001737A
Publication Date:
July 20, 2023
Filing Date:
January 07, 2022
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
C08G59/20; C08G59/50; C08G59/56; H05K3/28; H05K3/34
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano
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