Title:
ELECTROPLATED SOLDER TERMINAL AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3210547
Kind Code:
B2
Abstract:
PURPOSE: To allow a CrCu alloy layer to be selectively etched also and improve the yield and reliability of the structure of interconnection solder terminals, by etching a metal adhesive layer.
CONSTITUTION: The electroplated solder terminal comprises a lower metal adhesive layer 80, a CrCu intermediate barrier layer 85 on the adhesive layer 80, a soldered joint layer 90 on the CrCu layer 85, and an upper solder layer 120. The adhesive layer 80 is a TiW layer or TiN layer. To manufacture this improved terminal metal, unnecessary regions, such as the soldered joint layer, the intermediate barrier layer and the lower joint layer, are removed from the area outside the solder region, and the soldered joint layer 90, the CrCu intermediate barrier layer 85 and the TiW lower metal adhesive layer 80 are formed. Specifically, after the deposition of TiW, the CrCu layer is deposited from a CrCu alloy target by sputtering, and further a Cu layer is deposited form a Cu target by sputtering. Thereafter, solder is selectively applied to the open positions between substrates to form the solder layer 120, and then etching is performed.
Inventors:
Henry Atkinson Nai The Third
Jeffrey Frederick Loader
Ho-Ming Tong
Paul Anthony Totta
Jeffrey Frederick Loader
Ho-Ming Tong
Paul Anthony Totta
Application Number:
JP14186495A
Publication Date:
September 17, 2001
Filing Date:
June 08, 1995
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H01L21/60; H01L23/485; H05K3/34; (IPC1-7): H05K3/34; H01L21/60
Domestic Patent References:
| JP4333392A | ||||
| JP63305518A | ||||
| JP61206235A |
Other References:
【文献】米国特許5268072(US,A)
Attorney, Agent or Firm:
Jiro Yamamoto (2 outside)