Title:
ELECTROPLATING EQUIPMENT AND PLATING METHOD
Document Type and Number:
Japanese Patent JP2020132983
Kind Code:
A
Abstract:
To provide electroplating equipment in which film thickness distribution of plating can be measured.SOLUTION: The electroplating equipment according to the present invention comprises: a plating bath 1 that stores a plating solution 9 for electroplating; a power supply 8; a cathode 7b which is connected to a negative electrode 8b of the power supply 8, and on which an article to be plated 7 is placed; a soluble anode 4 which is immersed in the plating solution 9, connected to a positive electrode 8a of the power supply 8, and made of a material soluble to the plating solution 9 in an electroplating; an insoluble anode 2 which is immersed in the plating solution 9, connected in series to the soluble anode 4, connected to the positive electrode 8a of the power supply 8 via the soluble anode 4, disposed to face the article to be plated 7 along the plated surface 7a, made of a material insoluble to the plating solution 9, and divided into two or more pieces; an ammeter 5 measuring anode currents flowing through respective insoluble anodes 2; and a recording processing unit 6 calculating the thickness distribution of the plating of the article to be plated 7 based on a function relationship between the anode current recorded in advance and the plated film thickness of the article to be plated using each anode current.SELECTED DRAWING: Figure 1
Inventors:
OTANI ISSEI
Application Number:
JP2019031672A
Publication Date:
August 31, 2020
Filing Date:
February 25, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C25D21/14; C25D17/10; C25D21/00; C25D21/12
Attorney, Agent or Firm:
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka
Shigeaki Matsui
Kuratani Yasutaka