To provide an electroplating method which suppresses the generation of pinholes and pits of a plating film formed on the surface of a member to be plated, and to provide a plated member.
The method for producing a plated member includes filling a plating bath 20 with a plating solution 21 containing particles having an average particle size of 20 to 300 μm in an amount in the range of 5 vol.% to 65 vol.%; arranging a member to be plated 11 and an anode 13 in the plating solution in the plating bath; holding the pressure in the plating bath 20, in which the member to be plated 11 and the anode 13 have been arranged, at a pressure in the range of a vapor pressure Pb of the plating solution to (vapor pressure Pb+15 kPa); allowing the plating solution 21 to flow from the anode 13 in the upstream to the member to be plated 11 in the downstream in the plating bath 20 whose pressure is held; and applying voltage between the member to be plated 11 and the anode 13 while allowing the plating solution to flow, thereby forming a plating film on the surface of the member to be plated.
YAMADA YOSHIYASU
FURUHASHI TAKAHIRO
YAMADA:KK
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Jiro Kobe