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Patent Searching and Data


Title:
ELECTROSTATIC CHUCK
Document Type and Number:
Japanese Patent JP2000306986
Kind Code:
A
Abstract:

To obtain an electrostatic chuck that can increase the plasma- resistance property of an electrostatic chuck base, without damaging attraction force by the Johnson-Rahbek effect, can suppress generation of impurity elements that become the contamination source for a body to be attracted and generation leakage current accompanying reduction of resistivity, and can be used over a wide temperature range.

A plasma-resistant protection film 2, consisting of a low-impurity dielectric, is provided onto the surface of an electrostatic chuck base 3 made of one of ceramics, silicone resin, and polyimide. Furthermore, more specifically, on the surface of a ceramics sintering body 3 having resistivity of 1010-1015 Ωcm, an aluminum nitride film 2 formed by the gaseous phase synthesis method is provided. Also, the aluminum nitride film 2 preferably contains titanium with a ratio of 10 atom.% or less with respect to aluminum element.


Inventors:
KANEKO KAZUO
KANEKO KAYU
MORIKAWA SHIGERU
FUJII TAKAMITSU
KAJIMURA ATSUKO
Application Number:
JP11029499A
Publication Date:
November 02, 2000
Filing Date:
April 19, 1999
Export Citation:
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Assignee:
NIPPON ENG KK
KANSAI RES INST
International Classes:
H01L21/302; H01L21/3065; H01L21/68; H01L21/683; H02N13/00; (IPC1-7): H01L21/68; H01L21/3065; H02N13/00
Attorney, Agent or Firm:
Shuichiro Kitamura