To obtain the subject embedded encapsulation capable of protecting and reinforcing the mutual connection between an electronic part and a substrate in a microelectronic device by including a specific allylated amide compound, a hardening initiator, an arbitrary filler and an arbitrary fixer.
This embedded encapsulation contains an acrylamide compound of formula I {(m) is 0 or 1; (n) is 1 to 6; R9 is H, a 1-18C alkyl or the like; X is formulas II-IV or the like; Q is an alkyl(oxy), formula V [R2 is a 1-18C alkyl, an aryl or the like; R3 is an alkyl having ≤100 atoms in the chain, or the like; X is O, S, N or P; (v) is 0-50] or the like), a hardening initiator selected from a free radical initiator and/or a photoinitiator, one or more arbitrary fillers, and one or more arbitrary fixers.
HERR DONALD (US)
XIAO CHAODONG (US)
