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Title:
EMBEDDING METHOD AND DEVICE FOR GROUNDED ELECTRODE FOR GROUNDING RESISTANCE REDUCING MATERIAL
Document Type and Number:
Japanese Patent JP2002246138
Kind Code:
A
Abstract:

To easily and surely perform embedding of an earthing electrode and filling of grounding resistance reducing material.

According to this burying method, used are a harpoon 1, having a pointed end and a base substantially circular in plan view and a plurality of casings 3, having a diameter smaller than the outside diameter of the base 1b of the harpoon and fitted concentrically to a joining part 4 of the base of the harpoon and detachably connected to be added. A casing 3A, used in the initial stage driving, has a number of reducing material extraction holes on the peripheral surface thereof, the end part of the electrode is fixed to the vicinity of the outer peripheral part of the base of the harpoon, the casing 3A having the reducing material extraction holes is fitted and connected to the joining part of the harpoon to use the casing as a driving tool, which is driven into the ground by a hammering device, and sequentially the casings are added and driven to a designated depth. After that, the grounding resistance reducing material is injected through the casings, and extracted from a reducing material injection hole of the casings into the ground, in a gap produced by the difference in the outside diameters between that of the harpoon and of the casing, and subsequently, with the harpoon and the electrode left behind in the ground, the casing are pulled out to thereby embed the electrode.


Inventors:
KAYA REIZO
Application Number:
JP2001041429A
Publication Date:
August 30, 2002
Filing Date:
February 19, 2001
Export Citation:
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Assignee:
KAYA SHOJI KK
International Classes:
H01R4/66; H01R43/00; (IPC1-7): H01R43/00; H01R4/66
Attorney, Agent or Firm:
Kenji Yoshitake (5 others)