Title:
エナメル線及び塗料
Document Type and Number:
Japanese Patent JP7363488
Kind Code:
B2
Abstract:
To provide an enamel wire which can suppress partial discharge even when film thickness of an insulating film is not necessarily increased, and a coating material.SOLUTION: An enamel wire includes a conductor, and an insulating film. The insulating film is composed of polyimide. In the polyimide, a ratio A1/AT that is a ratio of a molar number A1 of a first repeating unit represented by formula (1) to a total molar number AT of the molar number A1 and a molar number A2 of a second repeating unit represented by formula (2) is 0.6 or more and 1.0 or less. In the polyimide, a ratio B1/BT that is a ratio of a molar number B1 of a first group to a total molar number BT of the molar number B1 and a molar number B2 of a second group is 0.8 or more and 1.0 or less. The first group is a group represented by any one of formulae (3) to (6) in R in formula (1) or formula (2). The second group is a group represented by formula (7) in R in formula (1) or formula (2).SELECTED DRAWING: None
Inventors:
Goshin Ushiwatari
Shuta Nabeshima
Yuki Honda
Shuta Nabeshima
Yuki Honda
Application Number:
JP2020000406A
Publication Date:
October 18, 2023
Filing Date:
January 06, 2020
Export Citation:
Assignee:
Proterial Co., Ltd.
International Classes:
H01B7/02; C09D179/08; H01B3/30
Domestic Patent References:
| JP201449377A | ||||
| JP201795594A | ||||
| JP2018116850A | ||||
| JP9106712A |
Foreign References:
| WO2014141322A1 | ||||
| WO2013136807A1 |
Attorney, Agent or Firm:
Nagoya International Patent Attorney Corporation
Previous Patent: proximity sensor
Next Patent: Mold opening/closing control method and control device for mold clamping device
Next Patent: Mold opening/closing control method and control device for mold clamping device