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Title:
ENCAPSULANT COMPOSITION FOR SOLAR CELL MODULE, ENCAPSULANT SHEET FOR SOLAR CELL MODULE, AND SOLAR CELL MODULE
Document Type and Number:
Japanese Patent JP2014212318
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an encapsulant composition for a solar cell module with high electrical insulation which can suppress generation of PID phenomena even when used for a long time under high temperature and humidity environments.SOLUTION: An encapsulant composition for a solar cell module comprises polyolefin based polymer, a cross-linker and a stabilizer. As the polyolefin based polymer, an ethylene vinyl acetate copolymer is used. As the cross-linker, an organic peroxide is used. As the stabilizer, an oligomer represented by a specific chemical formula is used which has a melting point of 50-150°C and a molecular mass of 2000-10000 g/mol.

Inventors:
JEON HAE SANG
KIM SUNG JIN
KIM GIL JOONG
CHEON JONG HUN
JUNG YONG JOO
JOO WEON CHEOL
Application Number:
JP2014084007A
Publication Date:
November 13, 2014
Filing Date:
April 15, 2014
Export Citation:
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Assignee:
TORAY ADVANCED MAT KOREA INC
International Classes:
H01L31/048; B29C48/08; B29C48/92; C08K5/14; C08K5/34; C08L23/08
Domestic Patent References:
JP2009152543A2009-07-09
JP2012009693A2012-01-12
Foreign References:
WO2011132560A12011-10-27
WO2010095603A12010-08-26
KR20120040359A2012-04-27
KR20100128503A2010-12-08
US20110253942A12011-10-20
Attorney, Agent or Firm:
Patent business corporation Takakazu patent firm