Title:
ENCAPSULANT COMPOSITION FOR SOLAR CELL MODULE, ENCAPSULANT SHEET FOR SOLAR CELL MODULE, AND SOLAR CELL MODULE
Document Type and Number:
Japanese Patent JP2014212318
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an encapsulant composition for a solar cell module with high electrical insulation which can suppress generation of PID phenomena even when used for a long time under high temperature and humidity environments.SOLUTION: An encapsulant composition for a solar cell module comprises polyolefin based polymer, a cross-linker and a stabilizer. As the polyolefin based polymer, an ethylene vinyl acetate copolymer is used. As the cross-linker, an organic peroxide is used. As the stabilizer, an oligomer represented by a specific chemical formula is used which has a melting point of 50-150°C and a molecular mass of 2000-10000 g/mol.
Inventors:
JEON HAE SANG
KIM SUNG JIN
KIM GIL JOONG
CHEON JONG HUN
JUNG YONG JOO
JOO WEON CHEOL
KIM SUNG JIN
KIM GIL JOONG
CHEON JONG HUN
JUNG YONG JOO
JOO WEON CHEOL
Application Number:
JP2014084007A
Publication Date:
November 13, 2014
Filing Date:
April 15, 2014
Export Citation:
Assignee:
TORAY ADVANCED MAT KOREA INC
International Classes:
H01L31/048; B29C48/08; B29C48/92; C08K5/14; C08K5/34; C08L23/08
Domestic Patent References:
JP2009152543A | 2009-07-09 | |||
JP2012009693A | 2012-01-12 |
Foreign References:
WO2011132560A1 | 2011-10-27 | |||
WO2010095603A1 | 2010-08-26 | |||
KR20120040359A | 2012-04-27 | |||
KR20100128503A | 2010-12-08 | |||
US20110253942A1 | 2011-10-20 |
Attorney, Agent or Firm:
Patent business corporation Takakazu patent firm