Title:
封入封緘システム
Document Type and Number:
Japanese Patent JP5960446
Kind Code:
B2
Abstract:
A sealing system for creating a sealed letter by use of an envelope sheet with a bond part on a basis of a sealing setting. The sealing system includes a transmission amount detector configured to detect an amount of transmission of the envelope sheet being conveyed on a conveyance path, a bond position calculator configured to calculate a first bond position where the bond part exists in the envelope sheet on a basis of the amount of transmission as detected by the transmission amount detector, and a judgment unit configured to judge whether the envelope sheet is conveyed a correct way round in a conveyance direction of the envelope sheet, from the first bond position as calculated by the bond position calculator and a second bond position based on the sealing setting.
Inventors:
Hirokazu Yabune
Application Number:
JP2012037307A
Publication Date:
August 02, 2016
Filing Date:
February 23, 2012
Export Citation:
Assignee:
Ideal Science Industry Co., Ltd.
International Classes:
B65B43/02; B31B50/88; B42D15/08; B43M5/04; B65B5/04; B65B57/02; B65H7/14
Domestic Patent References:
| JP2011131924A | ||||
| JP5092841A | ||||
| JP2001301723A | ||||
| JP2147546A | ||||
| JP3238578A | ||||
| JP2001505143A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Shunichi Takahashi
Masakazu Ito
Shunichi Takahashi