Title:
END SURFACE FINISHING DEVICE
Document Type and Number:
Japanese Patent JP2016104509
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a device for finishing the end surface of a product made of a brittle material.SOLUTION: The end surface finishing device 1 includes a surface 9, a fluid supply device configured to supply a magnetic viscous polishing fluid (MPF) ribbon 11 to at least one recess, at least one magnet 27 disposed adjacently to the surface 9 to selectively apply a magnetic field to the vicinity of the surface, and at least one holder 29 disposed to face the surface 9 and configured to support at least one product and selectively dip the end surface of the at least one product in the MPF ribbon 11 supplied to the at least one recess.SELECTED DRAWING: Figure 1
More Like This:
| JPH02152762 | POLISHING DEVICE |
| JP2008284684 | METHOD AND APPARATUS FOR POLISHING EDGE OF SUBSTRATE USING POLISHING ARM |
Inventors:
CHARLES MICHAEL DARCANGELO
STEVEN EDWARD DEMARTINO
ARIC BRUCE SHOREY
DANIEL DUANE STRONG
TAMMARO DAVID ALAN
VADDI BUTCHI REDDY
STEVEN EDWARD DEMARTINO
ARIC BRUCE SHOREY
DANIEL DUANE STRONG
TAMMARO DAVID ALAN
VADDI BUTCHI REDDY
Application Number:
JP2015238329A
Publication Date:
June 09, 2016
Filing Date:
December 07, 2015
Export Citation:
Assignee:
CORNING INC
International Classes:
B24B21/06; B24B7/24; H01L21/304
Domestic Patent References:
| JPH11511395A | 1999-10-05 | |||
| JP2010082746A | 2010-04-15 | |||
| JP2000233359A | 2000-08-29 | |||
| JP2001113447A | 2001-04-24 |
Foreign References:
| US20030060020A1 | 2003-03-27 |
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma