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Title:
METHOD AND APPARATUS FOR POLISHING EDGE OF SUBSTRATE USING POLISHING ARM
Document Type and Number:
Japanese Patent JP2008284684
Kind Code:
A
Abstract:

To provide a system adapted for polishing an edge of a substrate.

An apparatus adapted for polishing the edge of the substrate include (1) a polishing tape having a polishing surface and a second surface, (2) a longitudinal axis, and a polishing arm 201 adapted for contacting the polishing surface of the polishing tape with the edge of the substrate. The polishing arm 201 includes (i) a polishing head 204 adapted to contact with the second surface of the polishing tape, (ii) a rocker arm 304 connected to the polishing head 204 and adapted to rotate the polishing head 204 around the longitudinal axis of the polishing arm 201, and (iii) a load arm 314 extended adjacently along the rocker arm 304 and adapted to transfer the polishing head 204 in the direction orthogonal to the longitudinal axis of the polishing arm 201. Numerous other embodiments are provided. Further a method thereof is also provided.


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Inventors:
GARRY C ETTINGER
BUTTERFIELD PAUL D
MANENS ANTOINE P
Application Number:
JP2008132102A
Publication Date:
November 27, 2008
Filing Date:
May 20, 2008
Export Citation:
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Assignee:
APPLIED MATERIALS INC
International Classes:
B24B21/10; B24B9/00; B24B21/06
Domestic Patent References:
JP2005252288A2005-09-15
JP2007524231A2007-08-23
JPH07164301A1995-06-27
JP2004103825A2004-04-02
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Ikeda adult



 
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