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Title:
ENERGY RAY-CURABLE RESIN COMPOSITION, PROTECTIVE FILM USING THE COMPOSITION, TOUCH PANEL COMPONENT AND TOUCH PANEL COMPONENT MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2014024919
Kind Code:
A
Abstract:

To provide an energy ray-curable resin composition which exhibits preferable adhesion to a transparent resin film or an undercoat layer and electrodes even if heat treatment temperature is low.

A composition comprises: an alicyclic hydrocarbon group-containing (meth)acrylic copolymer of an acid value of 30 mg KOH/g or more; a (meth)acryloyl group-containing phosphoric acid ester compound (preferably of the specified general formula (I) or (II)); and one or more silane coupling agents selected from those based on epoxy, isocyanate, acid anhydride, or epoxy oligomer.


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Inventors:
KANEKO MASAKAZU
KATAJIMA AKIHIKO
SHIODA SATOSHI
Application Number:
JP2012165113A
Publication Date:
February 06, 2014
Filing Date:
July 25, 2012
Export Citation:
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Assignee:
DNP FINE CHEMICALS CO LTD
International Classes:
C08F2/44; C08F2/48; G06F3/041
Domestic Patent References:
JP2008165222A2008-07-17
JP2011248274A2011-12-08
JP2002287357A2002-10-03
JP2006053425A2006-02-23
JP2011102385A2011-05-26
JPH1010719A1998-01-16
JP2005097434A2005-04-14
JP2007290369A2007-11-08
JP2010037477A2010-02-18
JP2002196486A2002-07-12
Foreign References:
US20060293449A12006-12-28
WO2009047949A12009-04-16
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi



 
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