To obtain the subject composition having excellent photo-curing properties, heat resistance, solvent resistance, acid resistance, alkali resistance, etc., useful for producing a printed-wiring board, etc., by using a reaction product of a specific reaction product and a polybasic acid anhydride.
This composition comprises (A) a reaction product of (i) a reaction product of (a) an epoxy resin liquid at a normal temperature, (b) an aliphatic polybasic acid, (C) an aromatic polybasic acid and (d) an ethylenic unsaturated monocarboxylic acid and (ii) a polybasic acid anhydride, (B) (iii) an epoxy resin and (iv) an ultraviolet-curing resin and (C) (v) an epoxy curing agent and (vi) a photopolymerization initiator. Preferably the component (a) is a phenol novolak epoxy resin or a cresol novolak epoxy resin, especially an epoxy resin of the formula.
| WO/2012/009118 | CURABLE RESIN COMPOSITIONS |
| JP4119232 | Resin composition, prepreg and laminate |
| JP3615929 | Paint for fixed resistors |
ONO KAZUYOSHI
MAKINO SHIGEO
YASUDA KIYOMI
