Title:
EPOXY-MODIFIED SILICONE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3221718
Kind Code:
B2
Abstract:
PURPOSE: To provide the title compsn. having excellent mechanical strengths, good resistance to heat and moisture, and good workability.
CONSTITUTION: 100 pts.wt. resin component comprising 95-5wt.% epoxidized polyorganosiloxane and 5-95wt.% silicone resin having structural units of the general formula: R1SiO1.5 (wherein R1 is a monovalent, optionally substd. hydrocarbon group) or the general formula: SiO 2.0 and at least one silanol group is compounded with 0.005-50 pts.wt. cure catalyst to give the title compsn.
Inventors:
Hiroshi Kimura
Masahisa Nakajima
Yasutoshi Nagano
Masahisa Nakajima
Yasutoshi Nagano
Application Number:
JP9430492A
Publication Date:
October 22, 2001
Filing Date:
April 14, 1992
Export Citation:
Assignee:
GE Toshiba Silicone Co., Ltd.
International Classes:
C08G59/20; C08G59/00; C08G59/30; C08G59/40; C08G77/38; C08L63/00; C08L83/04; C08L83/06; (IPC1-7): C08L83/06; C08G59/20; C08G59/40; C08G77/38; C08L63/00
Domestic Patent References:
| JP56103224A | ||||
| JP5927952A | ||||
| JP6043371B2 |
Attorney, Agent or Firm:
Kaoru Furuya (3 outside)