Title:
EPOXY RESIN COMPOSITION FOR COLD-SETTING PREPREG, PREPREG AND COLD-SETTING METHOD FOR PREPREG
Document Type and Number:
Japanese Patent JP3699148
Kind Code:
B2
Abstract:
PURPOSE: To provide an epoxy resin composition for cold-setting prepreg free from problems of safety, sanitation, troublesome operation, curing characteristics, etc., compared with hand lay-up molding and to provide a prepreg and its curing method.
CONSTITUTION: The following component C is impregnated in a fiber-reinforced prepreg composed of an epoxy resin composition containing the following components A and B as essential components in the molding of the prepreg and the product is cured at normal temperature: (A) an epoxy compound having ≥2 glycidyl groups in one molecule; (B) a clathrate compound adsorbing an amine compound having active hydrogen; (C) a solution containing a compound acting as an expelling agent for the amine compound of the clathrate compound B. This invention also relates to an epoxy resin composition produced by using a clathrate compound B completely or partly coated with an organic polymer having a melting point or softening point of 40-100°C and a cold-setting prepreg produced by impregnating the epoxy resin composition in fibers.
Inventors:
Katsuhiro Yamada
Application Number:
JP7894395A
Publication Date:
September 28, 2005
Filing Date:
April 04, 1995
Export Citation:
Assignee:
Mitsubishi Rayon Co., Ltd.
International Classes:
C08J5/24; B32B5/28; C08G59/20; C08G59/22; C08G59/40; C08G59/50; (IPC1-7): C08G59/40; C08G59/50; C08J5/24
Domestic Patent References:
| JP59113036A | ||||
| JP7330871A | ||||
| JP63077923A | ||||
| JP63161018A | ||||
| JP6073162A | ||||
| JP5039673A | ||||
| JP36017478B1 | ||||
| JP8239452A |
Attorney, Agent or Firm:
Eisuke Fujimoto
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