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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION AND INSULATING SPACER
Document Type and Number:
Japanese Patent JPH09176288
Kind Code:
A
Abstract:

To obtain an epoxy resin compsn. having a low specific permittivity and excellent heat resistance, cracking resistance, and resistance to SF6 decomposition gas and to produce an insulating spacer therefor.

This insulating spacer for supporting a conductor in an insulating gas filling container comprises a cured product of an epoxy resin compsn. comprising a polyfunctional epoxy resin having an epoxy equivalent of 150 to 250, an acid anhydride curing agent, aluminum fluoride and alumina as a filler, and a flexibilizer. The amt. of the flexibilizer added is 3 to 30wt.% based on the epoxy resin and the acid anhydride curing agent. The aluminum fluoride to alumina mixing ratio is (9:1) to (5:5), and the amt. of the filler added is 30 to 65vol%. The epoxy compsn. has low specific permittivity and excellent heat resistance, cracking resistance, and stability against SF6 decomposition gas. This permits the size of an SF6 gas insulation switching device to be reduced and the reliability to be enhanced.


Inventors:
KOBAYASHI TOSHIYUKI
SUZUKI SHIGEO
OHARA SHUICHI
KOYAMA TORU
Application Number:
JP34219495A
Publication Date:
July 08, 1997
Filing Date:
December 28, 1995
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C08K3/16; C08G59/20; C08G59/42; C08K3/22; C08L63/00; H01B3/40; (IPC1-7): C08G59/42; C08G59/20; C08K3/16; C08K3/22; C08L63/00; H01B3/40
Attorney, Agent or Firm:
Unuma Tatsuyuki