Title:
EPOXY RESIN COMPOSITION FOR TRANSPARENT COMPONENT AND TRANSPARENT COMPONENT
Document Type and Number:
Japanese Patent JPH09176284
Kind Code:
A
Abstract:
To obtain a transparent epoxy resin component which is less likely to generate heat at the tie of curing, has excellent cuttability and transparency and is less likely to cause yellowing.
Thei resin compsn., for a transparent component, comprises the following components: (a). a bisphenol A type epoxy resin having a viscosity of not more than 80P at 25°C; (b). an epoxy resin curing agent comprising a polyoxypropylene amine-based diamine and triamine, the proportion of the diamine being 5 to 50wt.%; and (c). a hindered amine light stabilizer.
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Inventors:
SUGIMOTO TOSHIO
KAWAGUCHI SADAHIKO
KAWAGUCHI SADAHIKO
Application Number:
JP33890395A
Publication Date:
July 08, 1997
Filing Date:
December 26, 1995
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08K5/3432; C08G59/20; C08G59/24; C08G59/50; C08L63/00; (IPC1-7): C08G59/24; C08G59/50; C08K5/3432; C08L63/00
Attorney, Agent or Firm:
Hasegawa Moji