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Title:
EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY RESIN COMPOSITION AND METAL-CLAD LAMINATED SHEET
Document Type and Number:
Japanese Patent JP2009073996
Kind Code:
A
Abstract:

To provide an epoxy resin composition which has high heat resistance while keeping flame retardance, and also has excellent dielectric characteristics.

The epoxy resin composition contains: (A) an epoxy compound whose number average molecular weight is 1,000, which has at least two epoxy groups in a molecule, and which does not contain any halogen atom; (B) a polyphenylene ether whose number average molecular weight is 5,000; (C) a cyanate ester compound; (D) an organometallic salt; (E) and a phosphorus-based flame retardant.


Inventors:
FUJIWARA HIROAKI
IMAI MASAO
KITAI YUKI
Application Number:
JP2007246044A
Publication Date:
April 09, 2009
Filing Date:
September 21, 2007
Export Citation:
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Assignee:
PANASONIC ELEC WORKS CO LTD
International Classes:
C08L63/00; B32B15/092; C08G59/62; C08G59/68; C08J5/24; C08K5/49; H05K1/03
Domestic Patent References:
JP2006291098A2006-10-26
JP2006131743A2006-05-25
JPH10265669A1998-10-06
JPH09227659A1997-09-02
JP2006063157A2006-03-09
JP2004091748A2004-03-25
Foreign References:
WO2003099928A12003-12-04
Attorney, Agent or Firm:
Etsushi Kotani
Takao Ito
Jiro Higuchi



 
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