THERMOSETTING RESIN COMPOSITION FOR CONTINUOUSLY MANUFACTURED COPPER-CLAD LAMINATION PLATE, CONTINUOUS MANUFACTURING METHOD FOR COPPER-CLAD LAMINATION PLATE, AND COPPER-CLAD LAMINATION PLATE

Japanese Patent JP2009073995

A

To provide a thermosetting resin composition applicable for continuous production of a copper-clad lamination plate in which quick curing property suitable for continuous production is maintained and the obtained cured substance has characteristic of an epoxy resin, a copper-clad lamination plate using the composition, and a manufacturing method for the copper-clad lamination plate.

The thermosetting resin composition contains a liquid resin component containing a styrene based monomer and the epoxy resin containing two or more of epoxy groups in one molecule, an organic peroxide, an imidazole based curing promotor, and an inorganic filler. In the thermosetting resin composition for the continuously produced copper-clad lamination plate, 10-50 mass% of the styrene based monomer is contained in the liquid resin component.

INOUE HIROHARU
KASHIWABARA KEIKO
UNO MINORU
ISHIKAWA TOMOYUKI

JP2007246043A

April 09, 2009

September 21, 2007

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PANASONIC ELEC WORKS CO LTD

C08G59/50; B32B15/08; B32B15/092; C08J5/04; H05K1/03

JPS61280932A	1986-12-11
JPH02212544A	1990-08-23
JP2003082063A	2003-03-19
JP2003026773A	2003-01-29
JP2000336248A	2000-12-05
JPH07206979A	1995-08-08

Etsushi Kotani
Takao Ito
Jiro Higuchi

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