Title:
EPOXY RESIN COMPOSITION, PREPREG USING THE SAME, AND METAL-CLAD LAMINATED SHEET
Document Type and Number:
Japanese Patent JP2009073997
Kind Code:
A
Abstract:
To provide an epoxy resin composition which is preferably used as an insulating material for a printed circuit board, and which has flame retardance and high heat resistance.
The epoxy resin composition including: a brominated epoxy compound having at least two epoxy groups in a molecule; a cyanate ester compound; a hardening catalyst; and a free halogen adsorbent, is used. Zeolite, activated carbon, an ion exchanger, silica gel, and the like are preferably used as the free halogen adsorbent.
Inventors:
FUJIWARA HIROAKI
IMAI MASAO
KITAI YUKI
IMAI MASAO
KITAI YUKI
Application Number:
JP2007246045A
Publication Date:
April 09, 2009
Filing Date:
September 21, 2007
Export Citation:
Assignee:
PANASONIC ELEC WORKS CO LTD
International Classes:
C08G59/20; B32B15/08; B32B15/092; B32B27/38; C08G59/40; C08J5/24; C08K3/00; C08L63/00; C08L71/12
Domestic Patent References:
| JPH10265669A | 1998-10-06 | |||
| JP2000230110A | 2000-08-22 | |||
| JPH05140419A | 1993-06-08 |
Attorney, Agent or Firm:
Etsushi Kotani
Takao Ito
Jiro Higuchi
Takao Ito
Jiro Higuchi