PURPOSE: To obtain the subject composition containing an epoxy resin, a phenolic resin, a cure accelerator, an inorganic filler and a hardened and crushed epoxy resin composition having decreased internal stress, effective for environmental protection and the effective utilization of resources, having excellent thermal shock resistance and moisture resistance and useful for semiconductor element, etc.

CONSTITUTION: This resin composition contains (A) an epoxy resin such as bisphenol A epoxy resin, (B) a phenolic resin such as phenolic novolak resin, (C) a cure accelerator such as triphenylphosphine, (D) an inorganic filter such as fused silica powder and (E) preferably 5-50wt.% (based on the total weight of the composition) of a hardened and crushed epoxy resin composition having decreased internal stress.