To achieve a molding property of an extremely high accuracy by imparting a low molding shrinkage to an epoxy resin composition for sealing a semiconductor, having a good fluidity and molding property.

This resin composition containing the epoxy resin, a curing agent, an inorganic filler, an elastomer and a curing accelerator, contains 75-94 wt.% inorganic filler content and 0.1-10 wt.% elastomer content based on the total composition, and has ≤0.5% molding shrinkage of the cured material of the above resin composition.