Title:
SEALING MATERIAL COMPOSITION AND ELECTRONIC PART DEVICE
Document Type and Number:
Japanese Patent JP2001279057
Kind Code:
A
Abstract:
To provide a sealing material composition excellent in moisture resistant and having a good continuous working property and reflow resistance, and an electronic part device by using the same.
This sealing material composition is obtained by containing an epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphodphine with benzoquinone and hydrous bismuth nitrate oxide as essential components, and having 70-85 vol.% inorganic filler content based on the sealing composition and 2.5-20 pt.wt. blending amount of the hydrous bismuth nitrate oxide based on 100 pts.wt. epoxy resin. The electronic part device equipped with an element sealed by the above sealing material composition is also provided.
Inventors:
KAWADA TATSUO
SAKAI HIROYUKI
TSUKAHARA TERUKI
SAKAI HIROYUKI
TSUKAHARA TERUKI
Application Number:
JP2000030636A
Publication Date:
October 10, 2001
Filing Date:
February 08, 2000
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L63/00; C08G59/62; C08K3/28; C08K5/23; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; H01L23/29; H01L23/31
Domestic Patent References:
| JPH11310766A | 1999-11-09 | |||
| JP2000049259A | 2000-02-18 | |||
| JPH1135798A | 1999-02-09 | |||
| JPH02294354A | 1990-12-05 | |||
| JP4051758B | ||||
| JP2000204139A | 2000-07-25 | |||
| JP2000204140A | 2000-07-25 | |||
| JPH1025335A | 1998-01-27 | |||
| JPH10287795A | 1998-10-27 |
Attorney, Agent or Firm:
Kunihiko Wakabayashi
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