Title:
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2015093895
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor which is significantly improved in room temperature storability and to provide a semiconductor device using the same.SOLUTION: There is provided an epoxy resin composition for sealing a semiconductor which comprises an epoxy resin, a curing agent, a curing accelerator and an inorganic filler as essential components, where the curing accelerator contains a reaction product between an unsaturated fatty acid and an imidazole-based compound and contains 0.01 to 1 mass% of the reaction product between an unsaturated fatty acid and an imidazole-based compound based on the whole epoxy resin composition for sealing a semiconductor.
Inventors:
IKEDA HIRONORI
Application Number:
JP2013232895A
Publication Date:
May 18, 2015
Filing Date:
November 11, 2013
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C08G59/40; C08K3/00; C08K5/3445; C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Toshio Nishizawa