Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003128759
Kind Code:
A
Abstract:
To provide an epoxy resin composition for sealing a semiconductor having excellent characteristics of mold releasability and reliability.
This epoxy resin composition for sealing the semiconductor consists essentially of (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler, (D) a curing accelerator and (E) a compound represented by general formula (1) (wherein, R is a 1-4C alkyl group; and n is an integer of 0-4). In the resin composition, the compound represented by general formula (1) is contained in an amount of 0.01-3 wt.% in the whole epoxy resin composition.
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Inventors:
ENDO FUTOSHI
Application Number:
JP2001324606A
Publication Date:
May 08, 2003
Filing Date:
October 23, 2001
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K3/00; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08K3/00; C08L63/00; H01L23/29; H01L23/31