Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR SEALED BY SAME
Document Type and Number:
Japanese Patent JPH02227418
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition useful as adhesive, coating compound, prepreg, laminate, molding material, casting material, etc., having excellent toughness and water resistance without reducing heat resistance, containing a specific epoxy resin, a curing agent, etc. CONSTITUTION:The aimed composition containing an epoxy resin shown by formula I (R1 to R12 are H, halogen or 1-3C alkyl; Y is group shown by formula II; n is 0-2), a curing agent (e.g. triethylenetetramine) and, if necessary, a curing promoter (e.g. dimethylbenzylamine).
Inventors:
EBARA TOSHIHARU
NAKAMURA SHUJI
MORIYAMA HIROSHI
NAKAMURA SHUJI
MORIYAMA HIROSHI
Application Number:
JP4548689A
Publication Date:
September 10, 1990
Filing Date:
February 28, 1989
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
H01L23/29; C08G59/20; H01L23/31; (IPC1-7): C08G59/20; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Takahashi victory