Title:
NEW EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH02227417
Kind Code:
A
Abstract:
PURPOSE:To obtain the title composition suitable as coating compound, varnish, electrical insulating material, prepreg, electrically conductive adhesive, IC sealing, sealing material, casting material, etc., having excellent heat resistance and toughness, containing a specific epoxy resin, curing agent, etc. CONSTITUTION:The aimed composition containing an epoxy resin shown by formula I [R1 to R6 are H, 1-4C alkyl or halogen; Y is group shown by formula II (R7 to R16 are H, 1-4C alkyl or halogen); n is 0-2] and a curing agent (e.g. diethylenetriamine) and further, if necessary, a curing promoter (e.g. tertiary amine or Lewis acid).
Inventors:
NAKAMURA SHUJI
MIYAZAWA MASASHI
MIYAZAWA MASASHI
Application Number:
JP4548589A
Publication Date:
September 10, 1990
Filing Date:
February 28, 1989
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08G59/20; C07D303/24; C08G59/32; (IPC1-7): C08G59/20
Attorney, Agent or Firm:
Takahashi victory
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