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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION SUITABLE FOR PROTECTING FILM
Document Type and Number:
Japanese Patent JP2004315657
Kind Code:
A
Abstract:

To provide an epoxy resin composition for forming a protecting film which forms a protecting film excellent in adhesion properties and visible light transmission and, even when the surface of a base material is not flattened, having high surface smoothness and, particularly, exhibits excellent high-temperature resistance when used as a protecting film of a colored resin film for a color filter for a liquid crystal display.

The epoxy resin composition comprises (1) a specific epoxy resin A, (2) a polyhydric phenolic compound bearing a cyclic terpene skeleton and (3) an imidazole curing accelerator.


Inventors:
UMEYAMA TOMOE
KAWADA YOSHIHIRO
Application Number:
JP2003111480A
Publication Date:
November 11, 2004
Filing Date:
April 16, 2003
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
G02B5/20; C08G59/32; G02B1/10; (IPC1-7): C08G59/32; G02B1/10; G02B5/20