Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3389681
Kind Code:
B2
Abstract:
PURPOSE: To obtain the title composition which is excellent in releasability from a metal mold, maintains the releasability over a long period of time and is suitable for, e.g. semiconductor sealing.
CONSTITUTION: An epoxy resin composition containing an epoxy resin and a phenolic resin is mixed with a mold release comprising a compound having fluorine atoms and -CONH- group(s) in the molecule in an amount of 0.05-5 pts.wt. based on 100 pts.wt. total of the epoxy resin and the phenolic resin.
Inventors:
Toshio Shiobara
Kazutoshi Tomiyoshi
Shinichi Sato
Kazutoshi Tomiyoshi
Shinichi Sato
Application Number:
JP13520794A
Publication Date:
March 24, 2003
Filing Date:
May 25, 1994
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08K5/20; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; C08K5/20
Domestic Patent References:
| JP288635A | ||||
| JP5874743A | ||||
| JP6207082A | ||||
| JP5105802A | ||||
| JP5230339A | ||||
| JP3157449A | ||||
| JP6049023A | ||||
| JP61920A | ||||
| JP5262961A |
Attorney, Agent or Firm:
Takashi Kojima
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