Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH02102220
Kind Code:
A
Abstract:
PURPOSE:To make it possible to form an epoxy resin compsn. which is extremely stable at ordinary temp. and curable rapidly at a relatively low temp. by heating, by compounding xanthone as a latent curing agent for the epoxy resin. CONSTITUTION:This epoxy resin compsn. is prepd. by incorporating xanthone and/or a xanthone deriv. as a curing agent in an epoxy resin. There is no special limitation to the amount of xanthone, but in an ordinary case, it will suffice when it is in the range of 0.1:0.5-2.0 at an equivalent ratio to the epoxy resin. A catalyst for accelerating the curing reaction, a polymn. initiator and an accelerator for completing the curing by heating for a short time or a polymn. inhibitor for improving the storage stability of the resin compsn. at room temp. can be incorporated in this resin compsn. Means for curing this resin compsn. includes heating, ionizing radiation and light.
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Inventors:
HONJO HIROSHI
NISHIKAWA AKIO
NISHIKAWA AKIO
Application Number:
JP25473988A
Publication Date:
April 13, 1990
Filing Date:
October 12, 1988
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C08G59/56; C08G59/00; C08G59/40; C08G59/50; (IPC1-7): C08G59/50; C08G59/56
Attorney, Agent or Firm:
Katsuo Ogawa (2 outside)