Title:
エポキシ樹脂、硬化性樹脂組成物及びその硬化物
Document Type and Number:
Japanese Patent JP6809206
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide: an epoxy resin which has an excellent balance among fluidity during heat curing, a mold shrinkage factor and an elastic modulus; a composition; and a cured product thereof.SOLUTION: There are provided: an epoxy resin represented by the formula (1); a curable resin composition using the epoxy resin; and a cured product thereof. [Reach independently is an alkyl group having 4 to 8 carbon atoms and may be the same or different each repetition; G is a glycidyl group; and n is a repeating number of 0 to 10 on average.]SELECTED DRAWING: Figure 1
Inventors:
Yousuke Hirota
Application Number:
JP2016247862A
Publication Date:
January 06, 2021
Filing Date:
December 21, 2016
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08G59/06; B32B15/08; B32B15/092; C08J5/24; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
| JP6145293A | ||||
| JP6298902A | ||||
| JP7138502A | ||||
| JP7196770A | ||||
| JP2002105169A | ||||
| JP2015516308A | ||||
| JP9193539A |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno