To provide an epoxy resin molding material for sealing, which has good moldability in terms of flow property, curability, etc., and reduces warpage deformation even when used on a batch-molded, single-side sealed package, and an electronic component device equipped with an element sealed with the same.
The epoxy resin molding material for sealing contains (A) a silicon-containing polymer having bonds (a) and (b) (wherein R1 is chosen from (non)substituted monovalent 1-12C hydrocarbon groups, provided that all R1s in the silicon-containing polymer may be identical to or different from each other; and X is a monovalent organic group containing an epoxy group), has a functional group chosen from R1, a hydroxy group and an alkoxy group at its terminal and has an epoxy equivalent of 500-1,700, (B) an adduct of a tertiary phosphine compound and a quinone compound, (C) an epoxy resin and (D) a hardener.
ENDO YOSHINORI
AKAGI SEIICHI
IKEZAWA RYOICHI
| JP2005015565A | 2005-01-20 | |||
| JP2005015561A | 2005-01-20 | |||
| JP2005015559A | 2005-01-20 |