Title:
EPOXY RESIN MOLDING MATERIAL FOR SEALING
Document Type and Number:
Japanese Patent JPH05230173
Kind Code:
A
Abstract:
PURPOSE:To obtain the subjective molding material containing a specific epoxy resin, a specified phenol resin and a specific silica having a prescribed average- particle diameter and excellent in heat resistance, high thermal conductivity, crack resistance and moldability and useful for electrical and electronic parts, etc. CONSTITUTION:The objective molding material contains (A) an epoxy resin, etc., having a biphenyl skeleton, (B) a phenol resin having a naphthalene skeleton such as a novolak type phenol and (C) a silica having 5-30 micron average particle diameter.
Inventors:
SAKAMOTO TAKASHI
KIYOUGAKU MASAYUKI
HARA RYUZO
TORII MUNETOMO
KIYOUGAKU MASAYUKI
HARA RYUZO
TORII MUNETOMO
Application Number:
JP16073091A
Publication Date:
September 07, 1993
Filing Date:
July 02, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08G59/20; C08G59/00; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/20; C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Mikio Kawase (1 person outside)