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Patent Searching and Data


Title:
EQUIPMENT FOR FRACTIONAL RECOVERY OF METALLIC BASE MATERIAL FROM OBJECT TO BE PLATED AND METHOD FOR FRACTIONAL RECOVERY OF THE SAME
Document Type and Number:
Japanese Patent JP2003171788
Kind Code:
A
Abstract:

To provide equipment for efficiently fractionating and recovering a metallic base material from an object to be plated.

The equipment for fractionating and recovering the metallic base material from the object 3 to be plated which is formed with a metallic plating layer on the metallic base material consists of a vessel 2 for storing a dissolving liquid 1 for dissolving the metallic plating material, a container 4 for holding the object 3 to be plated in the liquid 1, an anodic body 5 for maintaining the object 3 to be plated at a plus potential and a cathodic body 6 of a minus potential for depositing the plating metal dissolved in the liquid 1 as essential components. Accordingly, the metallic plating layer of the object 3 to be plated is chemically and electrochemically dissolved and removed and therefore not only the metallic plating layer but the diffusion alloyed layer formed at the boundary between the metallic base material and the metallic plating layer as well are rapidly removed and the metallic base material can be recovered at a low cost.


Inventors:
KASHIMA TAKASHI
TANAKA HITOSHI
IWAMA HISASHI
KISO NORIYOSHI
Application Number:
JP2001369238A
Publication Date:
June 20, 2003
Filing Date:
December 03, 2001
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
B09B5/00; C22B1/00; C25C1/22; C25C7/00; C25C7/02; C25C7/08; B09B3/00; (IPC1-7): C25C7/02; B09B3/00; B09B5/00; C22B1/00; C25C1/22; C25C7/00; C25C7/08