Title:
EQUIPMENT FOR PROCESSING ELECTRONIC PART MOUNTING SUBSTRATE
Document Type and Number:
Japanese Patent JP3768297
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve working efficiency and to provide/high productivity and economy, by permitting cutting work at both going and returning operations, and by eliminating resetting work and others for circuit substrate when cutting the circuit substrate located in longitudinal and lateral directions.
SOLUTION: An electronic part mounting substrate is placed on a stage 211 and a reciprocating motion is given by a motor. A first cutting portion 410a and a second cutting portion 410b are alternately raised and lowered, and these motions are controlled by a balancing part 420. And when the first cutting portion 410a descends and is located at a predetermined position, a reciprocating motion is given to the stage 211 and the circuit substrate P is cut by a first cutting tooth 411a. Thereafter, when the stage 211 reaches a return position, the first cutting portion 410a is raised and the second cutting portion 410b descends. At the same time, the stage 211 is rotated by 90 degrees and the motor is rotated reversely. By doing this, the circuit substrate P is cut by the second teeth 411b. By doing this, the cutting of the circuit substrate P can be carried out during going motion and returning motion of the stage 211.
Inventors:
Takeshi Kobayashi
Application Number:
JP20767096A
Publication Date:
April 19, 2006
Filing Date:
July 19, 1996
Export Citation:
Assignee:
Ricoh Microelectronics Co., Ltd.
International Classes:
H05K13/00; H05K3/00; (IPC1-7): H05K13/00
Domestic Patent References:
| JP4035895U | ||||
| JP7314387A | ||||
| JP8039768A |
Attorney, Agent or Firm:
Makoto Monda