Etching liquid, replenishing liquid, and wiring forming method

Title:

Etching liquid, replenishing liquid, and wiring forming method

Document Type and Number:

Japanese Patent JP6354084

Kind Code:

B2

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Inventors:

Fukui Yu
Satoshi Saito
Terukazu Ishida

Application Number:

JP2015512332A

Publication Date:

July 11, 2018

Filing Date:

February 19, 2014

Export Citation:

Assignee:

MEC COMPANY

International Classes:

C23F1/18; H05K1/09; H05K3/06

Domestic Patent References:

Attorney, Agent or Firm:

Masato Shintaku
Yoshimoto Riki

Previous Patent: An underlay of paste

Next Patent: JPS6354085