Title:
ETCHING LIQUID FOR THERMOPLASTIC POLYIMIDE RESIN
Document Type and Number:
Japanese Patent JP2002180044
Kind Code:
A
Abstract:
To provide an etching liquid suitable for etching a thermoplastic polyimide resin.
This etching liquid consists of a ≤4C aliphatic amino alcohol having amino group, or imino and hydroxy groups in its molecule (e.g. monoethanolamine) and an aqueous tetraalkylammonium hydroxide solution (e.g. aqueous tetramethylammonium hydroxide solution), and by using the above etching liquid, it is possible to remove the thermoplastic polyimide at the adhesion layer so as not to generate a residue as shown in the figure.
More Like This:
| JP2001181631 | SURFACE IMPROVER FOR CERAMIC AND METHOD FOR PRODUCING THE SAME |
| JP2012033561 | ETCHANT FOR SILICON NITRIDE |
| JPH0664092 | MANUFACTURE OF COPPER-PLATED LAMINATED PLATE |
Inventors:
AKITA MASANORI
URASHIMA TOSHIO
KOYAMA MINORU
SUZUKI ATSUSHI
HASHINO YUKO
KANEKO YOSHIHARU
URASHIMA TOSHIO
KOYAMA MINORU
SUZUKI ATSUSHI
HASHINO YUKO
KANEKO YOSHIHARU
Application Number:
JP2000373268A
Publication Date:
June 26, 2002
Filing Date:
December 07, 2000
Export Citation:
Assignee:
TORAY ENG CO LTD
RAYTECH KK
RAYTECH KK
International Classes:
C09K13/00; C08J7/12; C09D9/00; H05K3/00; H05K1/03; H05K3/38; (IPC1-7): C09K13/00; H05K3/00