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Patent Searching and Data


Title:
POLYAMIDE/POLYPHENYLENE ETHER RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2007154128
Kind Code:
A
Abstract:

To provide a polyamide/polyphenylene ether resin composition that exhibits excellent heat resistance and low water absorption and, in particular, attains a high-level balance among impact resistance, sliding properties and molding processability.

The polyamide/polyphenylene ether resin composition comprises a semi-aromatic polyamide (A), a long-chain aliphatic polyamide (B), a polyphenylene ether (C) and a crystal nucleating agent (D), where the component (A) or (B) forms a continuous phase and the component (C) exists as a dispersed phase. The polyamide/polyphenylene ether resin composition has a mass ratio of the component (A) to the component (B) of 99/1 to 1/99, the polyamide mixture comprised of the component (A) and the component (B) having respective crystallization peaks in DSC (differential scanning calorimetry), and contains 0.001-2 pts.mass, based on 100 pts.mass of the total of the components (A)-(C), of the component (D).


Inventors:
NODA KAZUYA
TOKI MAKOTO
Application Number:
JP2005354774A
Publication Date:
June 21, 2007
Filing Date:
December 08, 2005
Export Citation:
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Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08L77/06; C08J3/20; C08K3/00; C08K5/09; C08K5/521; C08L71/12