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Title:
EVALUATION SUBSTRATE
Document Type and Number:
Japanese Patent JP2013057581
Kind Code:
A
Abstract:

To provide an evaluation substrate capable of simplifying an evaluation environment and attaining efficiency in evaluation.

An evaluation substrate 1 is used for evaluating a power module 2. The power module 2 includes: a power semiconductor device 3; and a temperature detection part 4 and voltage detection part 5 for detecting the characteristics of the power semiconductor device 3. A power source circuit 8, a photocoupler drive circuit 9, and a display part 10 are arranged on a substrate 7 of the evaluation substrate 1. The power source circuit 8 supplies power to the power module 2. The photocoupler drive circuit 9 drives the power semiconductor device 3. The display part 10 displays detection signals that have been input from the temperature detection part 4 and the voltage detection part 5.


Inventors:
KUMAGAI TOSHIYUKI
Application Number:
JP2011195691A
Publication Date:
March 28, 2013
Filing Date:
September 08, 2011
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01R31/28
Domestic Patent References:
JP2009281817A2009-12-03
JP2011099745A2011-05-19
JPH10134852A1998-05-22
JPS613075A1986-01-09
JP2004340899A2004-12-02
JPH11248782A1999-09-17
JP2008182835A2008-08-07
JPH1183938A1999-03-26
JP2003130920A2003-05-08
JP2007202280A2007-08-09
JP2007155640A2007-06-21
JPH02221882A1990-09-04
JPH01277779A1989-11-08
JP2002266394A2002-09-18
JP2001155787A2001-06-08
JPH06166241A1994-06-14
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Yoshimi Kuno



 
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