Title:
EXTERNAL CONNECTING PROTRUSION AND ITS FORMING METHOD, SEMICONDUCTOR CHIP, CIRCUIT BOARD AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2001110831
Kind Code:
A
Abstract:
To provide an outside connecting protrusion whose aspect ratio is high capable of reducing the usage of metal being materials and a method for forming the outside connecting protrusion, and for the provide a semiconductor chip using the protrusion, and a circuit board and electronic equipment.
In an outside connecting protrusion 10, a projecting body 22 made of resin is formed adjacently to an electrode pad 20, and a conductor 24 made of metal is formed across an electrode pad 14 and the projecting body 22. Thus, the outside connecting protrusion having a high aspect ratio can be easily formed.
Inventors:
TSUDA AKIHITO
Application Number:
JP28727699A
Publication Date:
April 20, 2001
Filing Date:
October 07, 1999
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Kisaburo Suzuki (2 outside)