To provide a fan cover, molded by sealing processing, with improved strength of a whole fan cover, and saving a space.

The fan cover includes bottom seat 2 and a side plate 3. The bottom seat 2 has a base part 21 and a joint part 24. The base part 21 has a shaft cylinder 23 made from material different from that of the base part 21, and the shaft cylinder 23 is axially extended to be projected on the base part 21. The joint part 24 is disposed along a peripheral edge of the bottom seat 2. The side plate 3 is disposed on the joint part 24, and is connected with the bottom seat 2 to define a space 5 between the side plate 3 and the bottom seat 2. Since the fan cover is molded by the sealing processing, the whole fan cover becomes thin, and the space used therefor is saved when it is used for an electronic device. At the same time, a problem of insufficiency of the space in the fan is solved, and the strength of the cover is enhanced.