Title:
FEEDING PART COVER STRUCTURE AND SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP2015142042
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a feeding part cover structure capable of preventing condensation in a feeding part, and a semiconductor manufacturing device.SOLUTION: There is provided a feeding part cover structure including: a feeding part in which a socket and a plug are fitted together; a cover structure covering the feeding part and sealing the feeding part; and a feed mechanism for feeding dry air or inert gas into the cover structure. The dry air or inert gas is fed through a gap between the feeding part and the cover structure to the inside of the cover structure.
Inventors:
SAKANE RYOTA
KITAGAWA DAI
KITAGAWA DAI
Application Number:
JP2014014607A
Publication Date:
August 03, 2015
Filing Date:
January 29, 2014
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/683; H01L21/3065
Domestic Patent References:
| JP2013143512A | 2013-07-22 | |||
| JP2011222931A | 2011-11-04 | |||
| JP2009170509A | 2009-07-30 | |||
| JP2008047657A | 2008-02-28 | |||
| JP2003160874A | 2003-06-06 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito