Title:
PROBER
Document Type and Number:
Japanese Patent JP2015142043
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a prober performing inspection at high speed with high accuracy, by suppressing vibration of a wafer chuck.SOLUTION: In a prober 1, chuck moving means 100 capable of moving a wafer chuck holding a wafer W in a three-dimensional direction includes a vertical direction moving mechanism 110 capable of moving a wafer chuck 2 in the Z axis direction, a lower horizontal direction heavy goods transfer mechanism 120 capable of moving the wafer chuck 2 and the vertical direction moving mechanism 110 in the X axis direction and Y axis direction while mounting the vertical direction moving mechanism 110, and an upper horizontal direction high speed moving mechanism 130 interposed between the wafer chuck 2 and the vertical direction moving mechanism 110, and capable of moving the wafer chuck 2 in the X axis direction and Y axis direction.
Inventors:
TAKAHASHI MASATOMO
Application Number:
JP2014014612A
Publication Date:
August 03, 2015
Filing Date:
January 29, 2014
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
H01L21/66
Attorney, Agent or Firm:
Takakichi Hayashi
Takamitsu Shimizu
Takamitsu Shimizu
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