Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FILLER MATERIAL FOR RESIN USED IN SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH05117543
Kind Code:
A
Abstract:

PURPOSE: To obtain the subject material, capable of readily controlling the grain diameter and having high mechanical strength and thermal conductivity and satisfying fundamental characteristics as a filler material by forming an outer layer of aluminum nitride on the surface of an inner layer composed of alumina.

CONSTITUTION: The objective material is obtained by forming an outer layer of aluminum nitride or sialon on the surface of an inner layer consisting essentially of alumina or alumina silica-based oxide. The maximum length of grains is 1-300μm. The material is prepared by heating, e.g. grains of a substrate composed of 99% alumina for a filler in a mixed Gas of NH3 and LPG at 1450°C and nitriding the surface. Furthermore, the thickness of the outer layer is preferably ≥0.1μm.


Inventors:
SUZUKI MASATAKA
SHINPO MASARU
Application Number:
JP30723791A
Publication Date:
May 14, 1993
Filing Date:
October 28, 1991
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOSHIBA CERAMICS CO
International Classes:
H01L23/29; C09C1/28; C09C1/40; H01L23/31; (IPC1-7): C09C1/28; C09C1/40; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Toru Tanabe