Title:
FILM DEPOSITION DEVICE OF METAL COATING, AND FILM DEPOSITION METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2023102109
Kind Code:
A
Abstract:
To provide a film deposition device of a metal coating, capable of suppressing the deterioration of film deposition quality by avoiding the dissolving of an undercoat layer of a substrate.SOLUTION: A film deposition device 1 comprises: an anode 11; an electrolyte film 13 that is disposed between the anode and a substrate B; a power source 14 that applies a voltage between the anode and the substrate by using the substrate as a cathode; a storage 15 that stores the anode 11 and an electrolytic solution L including a metal ion, with an opening 15d open toward the substrate side being covered with the electrolyte film 13; a base 18 that supports the substrate so that the substrate faces the electrolyte film; and a liquid pressure regulator 60 that raises the liquid pressure of the electrolytic solution stored in the storage. The base 18 comprises: a metallic placing plate 20 on which the substrate is placed; and an elastic body that energizes the placing plate toward the electrolyte film in a state where the electrolyte film is pressed against the substrate by the liquid pressure of the electrolytic solution.SELECTED DRAWING: Figure 1
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Inventors:
KONDO HARUKI
KURODA KEIJI
OKAMOTO KAZUAKI
INAGAKI KOJI
KURODA KEIJI
OKAMOTO KAZUAKI
INAGAKI KOJI
Application Number:
JP2022002474A
Publication Date:
July 24, 2023
Filing Date:
January 11, 2022
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
C25D17/06; C25D17/00; C25D21/00
Attorney, Agent or Firm:
Patent Attorney Corporation Hiraki International Patent Office