Title:
成膜装置およびそれを用いた成膜方法
Document Type and Number:
Japanese Patent JP7433884
Kind Code:
B2
Abstract:
To miniaturize a footprint of a film deposition device for forming a multilayer film.SOLUTION: A film deposition device includes: a chamber; a substrate support part capable of being lifted up and down in a vertical direction; and multiple cathode parts on which a target is set. The chamber is partitioned into multiple spaces by a partition wall including an opening port. The substrate support part can move between the multiple spaces through the partition. The multiple cathode parts are respectively disposed in the multiple spaces.SELECTED DRAWING: Figure 1
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Inventors:
Kazuya Demura
Application Number:
JP2019230521A
Publication Date:
February 20, 2024
Filing Date:
December 20, 2019
Export Citation:
Assignee:
Canon Inc
International Classes:
C23C14/56; C23C14/34
Domestic Patent References:
| JP2004091905A | ||||
| JP5152215A |
Attorney, Agent or Firm:
Takuma Abe
Yoshiko Takahashi
Shichiro Nakatsuji
Kazushi Tomita
Yasunao Daitomo
Yoshiko Takahashi
Shichiro Nakatsuji
Kazushi Tomita
Yasunao Daitomo