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Title:
FILM-FORMING COMPOSITION, INSULATING FILM AND ELECTRONIC DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2006291160
Kind Code:
A
Abstract:

To provide a film-forming composition, especially the film-forming composition forming an insulating film used in an electronic device, etc., and having low dielectric constant and a small change in relative permittivity with time and to provide the electronic device having the insulating film.

The film-forming composition is characterized as follows. The composition comprises a compound having a cage type structure and the content of each metal in the composition is ≤300 ppb, respectively. The insulating film is formed by using the film-forming composition and the electronic device has the insulating film.


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Inventors:
ADEGAWA YUTAKA
ASANO AKIRA
Application Number:
JP2005247944A
Publication Date:
October 26, 2006
Filing Date:
August 29, 2005
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
C08G85/00; C08G61/02; H01L21/312
Domestic Patent References:
JPH11327144A1999-11-26
JP2000510520A2000-08-15
JP2002006499A2002-01-09
JP2004134738A2004-04-30
JP2004214161A2004-07-29
JP2004256479A2004-09-16
JPH11305439A1999-11-05
JP2004006607A2004-01-08
JPH0687911A1994-03-29
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu



 
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