Title:
成膜装置
Document Type and Number:
Japanese Patent JP7108347
Kind Code:
B2
Abstract:
The present application provides a film formation device comprising: a vacuum container; a substrate holding means which can rotate around an axis line and can hold a plurality of substrates; a film formation region which is located in the inside of the vacuum container and can make it possible to release sputter ions from a target by sputtering to allow the sputter ions to reach the substrates; and a separation means which can separate the film formation region from the other region in the vacuum container and is removably attached to the inside of the vacuum container. The quality of film formation can be improved by the film formation device provided by the present application.
Inventors:
Arihiro Shioda
Takaaki Aoyama
Endo Mitsuto
Week of Nagae
Takaaki Aoyama
Endo Mitsuto
Week of Nagae
Application Number:
JP2021555903A
Publication Date:
July 28, 2022
Filing Date:
June 24, 2020
Export Citation:
Assignee:
Syncron Co., Ltd.
International Classes:
C23C14/34; H01L21/677
Domestic Patent References:
JP2018090867A | ||||
JP2014222693A |
Foreign References:
WO2012053171A1 |
Attorney, Agent or Firm:
Eternal patent business corporation